Master Bond Consumable
One Component Epoxy Systems
No-mix one part epoxies in liquid, paste and solid forms, with conventional, fast, low-temperature heat, UV and dual UV/heat cure options.
Description
One component epoxy systems need no mixing and are available as liquids, pastes and solids (films and preforms). Specific grades meet NASA low outgassing, USP Class VI and halogen-free requirements, and select products have been tested for 1000 hours at 85°C/85% RH.
Cure options
- Conventional, fast and snap heat cures (most at 125°C to 150°C)
- Low temperature heat cure at 80–100°C
- B-staged systems
- UV light cure and dual UV/heat cure
- Premixed and frozen two-part systems in single cartridges or syringes
Applications
Bonding, sealing and coating in electronic, aerospace, electrical, automotive, oil and chemical processing, optical and medical assemblies.
Specifications
| Typical heat cure | 125°C to 150°C |
|---|---|
| Low temperature heat cure | 80°- 100°C |
More from Master Bond
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- Master Bond Epoxy Adhesive Films & Preforms
- Master Bond UV Curable Adhesives
- Master Bond LED Light Curable Adhesives
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- Master Bond Silicone Systems (MasterSil)
- Master Bond Polysulfide Modified Epoxies
- Master Bond Urethane Modified Epoxies
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